Wafer surface modification and precision bonding equipment
Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!
This product is a device for precision bonding of wafer-level silicon, metal, quartz, glass, etc., after surface modification treatment in a vacuum or any atmosphere. It supports various bonding for 4 to 6-inch wafer levels. We propose surface modification treatments and precision bonding models suitable for bonding materials such as anodic bonding, diffusion/eutectic bonding, direct bonding, and thermocompression bonding. 【Features】 ■ Supports various bonding for 4 to 6-inch wafer levels ■ Pre-treatment function with surface modification treatment suitable for any material ■ Bonding system equipped with uniform heating and pressurization functions ■ Heating and cooling system to reduce residual stress ■ Capable of operating in ultra-high vacuum to pressurized atmosphere ■ Control mechanism for arbitrary position pressurization and voltage application *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケニックス
- Price：Other
